VIDEO
Vertical Power Delivery platform designed to break through power and thermal limits
Video Summary
Hans Hasselby-Andersen, CEO of Lotus Microsystems, explains how, as modern AI accelerators draw increasingly massive current loads, legacy architectures are struggling to keep pace. The company's vStrata introduces the first low-profile platform designed to solve electrical, thermal and mechanical constraints as a single, co-engineered system. Where existing Vertical Power Delivery solutions treat power and thermal challenges as separate problems, treat vStrata solutions address both simultaneously using proprietary silicon Power Interposer Technology (PIT), bringing power directly beneath the processor while managing thermal load at the same point.
