Power Electronics International (PEI) delivers authoritative insight into the technologies and strategies shaping the next era of electrification. From device innovation to system-level integration, PEI connects the entire power electronics ecosystem, spanning materials, modules, packaging, and application deployment.

Power electronics sits at the centre of global infrastructure transformation. It underpins electrification across automotive, renewable energy, industrial systems, aerospace, and digital infrastructure. As demand accelerates, the conversation is no longer limited to conversion efficiency. It now focuses on power density, system integration, thermal performance, reliability, and intelligent control.

Growth is being driven by three structural shifts. First, the rapid expansion of electric vehicles and electrified transport, where inverter design, onboard charging, and high-voltage architectures are critical. Second, the scaling of renewable energy and grid modernisation, requiring advanced conversion, storage integration, and grid-interactive systems. Third, the rise of AI-driven digital infrastructure, where power delivery, efficiency, and thermal management directly impact performance at scale.

At the device level, wide bandgap technologies are redefining performance boundaries. Silicon Carbide (SiC) and Gallium Nitride (GaN) are enabling higher switching speeds, improved efficiency, and reduced system size across applications. SiC continues to dominate high-voltage, high-power environments such as EV traction and grid infrastructure, while GaN is accelerating adoption in fast charging, data centre power supplies, and high-frequency conversion. Alongside this, silicon technologies continue to evolve, particularly in cost-sensitive and high-volume applications.

However, the real innovation is happening beyond the device. Advanced packaging, module design, thermal management, and system-level optimisation are now the key differentiators. Engineers and decision-makers are focused on how to integrate these technologies into scalable, reliable, and manufacturable solutions.

PEI reflects this shift. Our editorial coverage spans:

• Power module innovation and advanced packaging
• Wide bandgap device integration and applications
• Thermal management and reliability engineering
• Application-focused system design across automotive, energy and industry
• AI-enabled optimisation and intelligent power systems
• Testing, qualification, and lifecycle performance

Through in-depth features, executive interviews, technical analysis, and webinars, PEI provides a platform for organisations to engage directly with engineers, designers, and senior decision-makers shaping the future of power electronics.

Position your brand at the centre of the power electronics transformation.

Please email all press releases and articles to Jackie Cannon - Publisher.
jackie.cannon@angelbc.com
Supply all releases / article in word file, if images are supplied please provide them high resolution in 300 dpi.

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