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Wednesday 3rd June 2026
Joint US-Taiwan initiative to scale the future of SiC
Tuesday 2nd June 2026
Fraunhofer IAF to show GaN4EmoBil module at PCIM
Tuesday 2nd June 2026
From road to rack: IDTechEx reports on 800V innovations
Tuesday 2nd June 2026
GE Aerospace qualifies SiC solutions for military vehicles
Tuesday 2nd June 2026
EPC supports NVIDIA MGX with 800V-to-12.5V design
Monday 1st June 2026
QPT starts demos of MicroDyno
Monday 1st June 2026
QPT starts demos of MicroDyno
Monday 1st June 2026
Rohm launches PLECS simulator
Monday 1st June 2026
PI announces PowiGaN designs for 800 VDC AI data centres
Monday 1st June 2026
Infineon introduces first 205degC SiC power module
Wednesday 27th May 2026
Polar and Nexperia partner on power MOSFET manufacturing
Wednesday 27th May 2026
EPC appoints Mouser as global distributor
Wednesday 27th May 2026
ST adds 700V GaN devices for high-demand applications
Wednesday 27th May 2026
Microchip launches 3.3 kV SiC modules
Tuesday 26th May 2026
Element14 community launches transport design challenge
Thursday 21st May 2026
Infineon launches EU flagship project Moore4Power
Wednesday 20th May 2026
Richardson partners with NoMIS in HV SiC
Wednesday 20th May 2026
Infineon 40V CoolGaN BDS family shrinks portable power designs
Tuesday 19th May 2026
ST expands 800 VDC AI data centre power offering
Monday 18th May 2026
CSA Catapult powers next-gen electric taxiing in new project
Monday 18th May 2026
NoMIS joins ARPA-E DC-GRIDS consortium
Friday 15th May 2026
A new way to measure WBG device defects
Thursday 14th May 2026
Vishay TVS deliver 3000W dissipation in DFN6546A package
Tuesday 12th May 2026
Infineon expands XHP 2 CoolSiC range
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