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Thursday 4th June 2026
CGD's 650V ICeGaN devices improve EV range
Thursday 4th June 2026
EPC targets motion systems with GaN ePower stage ICs
Thursday 4th June 2026
CSA Catapult turns research into Double Pulse Testing
Thursday 4th June 2026
JEDEC releases new SiC guidelines
Thursday 4th June 2026
Wise to unveil digital control roadmap at PCIM 2026
Thursday 4th June 2026
Rohm SiC MOSFET adopted in HVDC AI servers
Thursday 4th June 2026
Navitas shows DC-DC board at NIVDIA event
Thursday 4th June 2026
Vishay 200A module saves space in MHEVs and LEVs
Wednesday 3rd June 2026
Joint US-Taiwan initiative to scale the future of SiC
Tuesday 2nd June 2026
Fraunhofer IAF to show GaN4EmoBil module at PCIM
Tuesday 2nd June 2026
From road to rack: IDTechEx reports on 800V innovations
Tuesday 2nd June 2026
GE Aerospace qualifies SiC solutions for military vehicles
Tuesday 2nd June 2026
EPC supports NVIDIA MGX with 800V-to-12.5V design
Monday 1st June 2026
QPT starts demos of MicroDyno
Monday 1st June 2026
QPT starts demos of MicroDyno
Monday 1st June 2026
Rohm launches PLECS simulator
Monday 1st June 2026
PI announces PowiGaN designs for 800 VDC AI data centres
Monday 1st June 2026
Infineon introduces first 205degC SiC power module
Wednesday 27th May 2026
Polar and Nexperia partner on power MOSFET manufacturing
Wednesday 27th May 2026
EPC appoints Mouser as global distributor
Wednesday 27th May 2026
ST adds 700V GaN devices for high-demand applications
Wednesday 27th May 2026
Microchip launches 3.3 kV SiC modules
Tuesday 26th May 2026
Element14 community launches transport design challenge
Thursday 21st May 2026
Infineon launches EU flagship project Moore4Power
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