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Tuesday 21st November 2023
Toshiba launches first 30V N-channel common-drain MOSFET
Tuesday 21st November 2023
Onsemi opens European EV systems lab
Monday 20th November 2023
Infineon adds 62mm package to CoolSiC portfolio
Monday 20th November 2023
Legrand chooses Innoscience GaN chips
Thursday 16th November 2023
Transphorm and Allegro partner on GaN driver solution
Thursday 16th November 2023
QPT shortlisted for ABB power density challenge
Wednesday 15th November 2023
Infineon revenue and profits up
Tuesday 14th November 2023
Heraeus acquires stake in start-up Zadient
Tuesday 14th November 2023
OKI develops GaN lift off/bonding technology
Tuesday 14th November 2023
Odyssey is meeting key milestones, says CEO
Monday 13th November 2023
VisIC adds top side cooled isolated package
Monday 13th November 2023
Nexperia and Mitsubishi announce SiC partnership
Monday 13th November 2023
Transphorm posts Q2 2024 results
Monday 13th November 2023
Navitas announces Q3 results
Thursday 9th November 2023
Power Integrations increases quarterly revenue
Thursday 9th November 2023
Flex adds quarter brick 8:1 input 100W DC/DC
Thursday 9th November 2023
Vishay to acquire Nexperia's Newport wafer fab
Wednesday 8th November 2023
Rohm completes acquisition of SiC site
Wednesday 8th November 2023
Rohm gate driver maximises GaN performance
Wednesday 8th November 2023
Diamond Foundry shrinks EV inverters
Tuesday 7th November 2023
UCLA researchers develop thermal transistor
Tuesday 7th November 2023
Toshiba Launches 30V MOSFET
Tuesday 7th November 2023
Toshiba 600V IPDs target BLDC motor drives
Monday 6th November 2023
CGD signs agreement to develop ultra-efficient power products
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