Coherent 300mm SiC platform addresses AI needs
Coherent has announced that its next-generation 300mm SiC platform will address the increasing higher power density, faster switching, and thermal efficiency demands in AI data centre infrastructure.
“AI is transforming the thermal-management landscape in data centres, and SiC is emerging as one of the foundational materials enabling this scalability,” said Gary Ruland, SVPt and general manager at Coherent. “Our 300mm platform, which we plan to ramp in high volumes, delivers new levels of thermal efficiency that translate directly into faster, more power-efficient AI data centres.”
The platform’s conductive SiC substrates provide low resistivity, low defect density, and high homogeneity, enabling low-dissipation, high-frequency, and good thermal stability. In AI and data infrastructure, these properties boost energy efficiency and thermal performance in next-generation data centre systems.
In addition, the company says the technology brings benefits for AR/VR devices, enabling thinner and more efficient waveguides for AR smart glasses and VR headsets, improving reliability in compact immersive display modules.
