Infineon dual phase power family targets AI data centres
Infineon has introduced the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation AI accelerators and vertical power delivery modules.
Integrating Infineon's OptiMOS 6 MOSFETs and a dual-phase driver IC in a compact 6 x 6 x 0.8 mm³ package, the new family delivers benchmark power density exceeding 2 A/mm², setting a new reference point for power stage performance in high-current AI processor applications. As hyperscalers and datacenter operators continue to scale AI infrastructure, the demand for power delivery solutions that combine higher current capability with shrinking physical footprints is becoming a critical bottleneck.
“Infineon customers are designing AI systems that will define the next decade of computing infrastructure," said Rakesh Renganathan, VP Power ICs at Infineon. “The TDA235E5 and TDA235E0 power stages give designers the power density, thermal performance, and design flexibility to move faster and build with confidence, backed by Infineon's full AI server power delivery ecosystem.”
The two devices support up to 300 A peak current and 120 A total design current (TDC), making them well suited for next-generation AI xPU accelerators as well as conventional server CPUs in data centre environments.
Both lateral and vertical power delivery configurations are supported. Superior thermal impedance from junction to top side enables efficient liquid cooling integration. Combined with Infineon's digital multiphase controllers, the power stages are said to support flexible, scalable multi-rail architectures that reduce time to deployment in fast-evolving AI server platforms.
Engineering samples for TDA235E5 and TDA235E0 are now available for customer evaluation.
