EPC to show next gen GaN at electronica 2026
Efficient Power Conversion (EPC) will show its latest eGaN FETs, integrated power stages and reference designs at electronica 2026, November 10–13 in Munich, Germany.
EPC will demonstrate how GaN technology is enabling smaller, lighter, faster and more efficient power systems for emerging applications including AI, physical AI, robotics, autonomous machines and space electronics.
A key focus will be the role of GaN in the rapidly evolving AI power infrastructure. EPC will demonstrate solutions spanning the power-delivery chain, from 800 VDC distribution to point-of-load conversion, including the EPC91123 6 kW 800 V-to-12.5 V ISOP LLC converter and a new 6 kW 800 V-to-6 V converter designed to bring high-voltage power closer to next-generation AI processors.
EPC will also highlight Gen8 GaN power-stage technology, targeting ultra-high-frequency, low-voltage conversion and direct conversion from approximately 6.25 V to sub-1 V processor rails at multi-megahertz frequencies.
For physical AI and robotics, EPC will demonstrate integrated GaN solutions for humanoid robots, drones and other intelligent motion systems. The EPC33110 100 V three-phase integrated ePower Stage IC enables compact, high-performance motor drives, while the new EPC33111, shown in preview, targets further miniaturisation for space-constrained applications.
Multiple motor-drive reference designs will also be demonstrated, including platforms based on EPC33110 and the latest Gen7 GaN devices.
In space electronics, EPC Space will showcase radiation-hardened GaN technology for DC-DC converters, POL/IVR applications and space computing, including the EPC7011, EPC7009 and radiation-tolerant EPC7050PCSH, EPC7066PCSH and EPC7065PCSH devices.
“From 800 V power distribution for AI to high-performance motor drives and radiation-hardened space electronics, GaN is enabling new levels of system integration,” said Alex Lidow, CEO of EPC. “At electronica, visitors will see how EPC is applying GaN across the power, motion and computing architectures of next-generation electronic systems.”
During electronica 2026, EPC will also host a series of LIVE technical sessions at Hall C6, Booth 221, featuring EPC experts and covering the latest developments in GaN technology and its applications.
Sessions include:
Nov. 10, 2:00–2:30 p.m. “Where is GaN Going?” - Alex Lidow, CEO, EPC
Nov 11, 11-11.30 a.m. “Radiation-Hardened GaN: From Niche to Mainstream” - Bel Lazar, CEO, EPC Space
Nov. 11, 2:00–2:30 p.m. “New 100 V Half-Bridge and Three-Phase GaN ICs for Robots and Drones” - Marco Palma, VP, Motor Drive Marketing and System Engineering, EPC
Nov. 12, 11:00–11:30 a.m. “Disrupting High-Voltage Applications Using Low-Voltage GaN FETs in Multi-kW Isolated Converters” - Michael De Rooij, GaN Applications Fellow, EPC
Nov 12, 2.00pm – 2.30pm “Mission Profile Reliability of GaN Devices for AI Data centres “ - Shengke Zhang, VP of Reliability and Global FAE, EPC
