Infineon signs 200mm SiC wafer agreement with Wolfspeed
Infineon and Wolfspeed have signed a new multi-year supply agreement for 200mm SiC wafers, changing Infineon's existing Wolfspeed supply relationship from 150mm to 200mm substrate technology.
“SiC is at the heart of the energy transition, and securing a high-quality, resilient supply of 200mm substrates is essential to delivering on our customers’ long-term commitments,” said Alexander Gorski, COO at Infineon. “This agreement further broadens our strong supply base for our 200mm high-volume manufacturing, building on a 20-year supply relationship between our two companies. It strengthens supply chain security for our customers and provides additional flexibility and scalability to support Infineon's future growth.”
AI data centres are beginning to emerge as a significant demand driver for SiC power semiconductors. Power conversion efficiency across the data centre power chain is a direct operating cost consideration for hyperscalers managing infrastructure at scale. The switching efficiency and thermal performance of SiC make it a technically suitable option for specific power conversion stages where silicon reaches its practical limits. Together with growing SiC adoption across electric vehicle drivetrains, solar inverters and industrial motor drives, these trends support a strong long-term outlook for high-quality 200mm SiC substrates.
The transition to 200mm SiC wafers delivers large manufacturing economics compared to 150mm production. Larger wafer diameter increases usable die area per wafer, reduces per-unit substrate cost, and improves overall manufacturing efficiency.
Infineon operates a multi-source SiC substrate strategy to maintain supply chain flexibility, including its 200mm SiC fab in Kulim, Malaysia, which is designed to be the world’s largest and most competitive SiC manufacturing facility.
