Latest Rohm SiC modules available online
Rohm has begun online sales of new SiC moulded modules: TRCDRIVE pack, HSDIP20 and DOT-247 from distributors such as DigiKey.
The TRCDRIVE pack is a 2-in-1 SiC moulded module compatible with traction inverters for xEV up to 300kW. Rohm's 4th Generation SiC MOSFETs with low ON resistance are built in -- resulting in power density 1.5 times higher than general SiC molded modules, while contributing to the miniaturisation of inverters for xEVs. Furthermore, its terminal layout allows connection by pushing the gate driver board from the top, reducing installation time.
The HSDIP20 is a SiC module in 4-in-1 and 6-in-1 configurations, suitable for xEV onboard chargers, EV charging stations, server power supplies and AC servos. The lineup includes six 750V and seven 1200V models. All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload and enabling circuit miniaturisation.
The DOT-247 is a 2-in-1 SiC module ideal for industrial applications such as PV inverters and UPS systems. The module retains the versatility of the widely adopted "TO-247" package while achieving high power density. It supports various circuit configurations through two topologies: half-bridge and common-source.
By adopting it in power conversion circuits that incorporate multiple discrete components, it reduces the number of components and mounting area, supporting miniaturisation and lower design effort, according to Rohm.
