Infineon adds SPICE-based model generation to IPOSIM
Infineon has announced that its Infineon Power Simulation Platform (IPOSIM)– used to calculate losses and thermal behaviour of power modules, discrete devices, and disc devices – now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations.
The first version supports 1200V SiC devices in IPOSIM’s predefined 3-phase 2-level (discretes) topology, together with 36 compatible gate drivers.
Future updates will extend coverage to CoolMOS, CoolSiC modules, OptiMOS, and GaN devices and more gate driver devices.
With this addition, the tool delivers more accurate results for static, dynamic, and thermal performance, taking into consideration non-linear semiconductor physics of the devices, according to Infineon. This enables advanced device comparison under a wide range of operating conditions and faster design decisions.
Developers can customise their application environment to reflect real-world operating conditions directly within the workflow, and optimise their designs at an early stage of the development process.
The device characterisation reflects the switching behaviour under more realistic operating scenarios, taking the selected gate driver into account. The capability is integrated into IPOSIM’s multi-device comparison workflow, enabling users to select devices marked with the SPICE icon, configure application environments, and follow a guided simulation process.
The solution is available online, and free of charge.
