Infineon launches EasyPACK C
Infineon is launching EasyPACK C, the next generation of its EasyPACK package family for fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and UPS that operate under harsh conditions and fluctuating load profiles.
The first products in this new package are SiC power modules that integrate Infineon’s CoolSiC MOSFETs 1200 V G2 and the company’s proprietary .XT interconnection technology. These enable designs with more than 30 percent higher power density and up to 20 times longer lifetime compared to the previous generation of CoolSiC MOSFETs, according to Infineon.
In addition, they offer a significant reduction in RDS(on), with around 25 percent improvement.
The modules withstand overload switching conditions up to Tvj(over) = 200°C. They include new PressFIT pins that double current capacity, reduce PCB-level temperatures, and improve the mounting process. A new plastic material and silicone gel support operating temperatures of up to Tvj(op) = 175°C. Isolation rating is 3 kV AC for one minute.
The new modules in the EasyPACK C package are available in various topologies, including 3-level and H-bridge configurations, with options with and without thermal interface material.
