Interview with EPC

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Interview with EPC

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Interviewed at PCIM 2026

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Interview with EPC

Interview with EPC

European semiconductor ecosystem demonstrates RESOLVE

European semiconductor ecosystem demonstrates RESOLVE

Building better batteries brings multiple benefits

Building better batteries brings multiple benefits

Microtest morphs into Cosmic – with Equipment and Services divisions

Microtest morphs into Cosmic – with Equipment and Services divisions

MicroDyno demos design optimisation cut from months to days

MicroDyno demos design optimisation cut from months to days

Vertical Power Delivery platform designed to break through power and thermal limits

Vertical Power Delivery platform designed to break through power and thermal limits

Reinventing engineering for the Age of AI

Reinventing engineering for the Age of AI

Full speed ahead for SiC

Full speed ahead for SiC

Intelligent Thermal Fabric addresses AI-driven data centre power challenges

Intelligent Thermal Fabric addresses AI-driven data centre power challenges

Vibrational exfoliation - a sustainable method for producing graphene

Vibrational exfoliation - a sustainable method for producing graphene

Power Electronics market to exceed US$65 billion by 2036

Power Electronics market to exceed US$65 billion by 2036

Silicon capacitors: A ubiquitous enabler in advanced 3D-integrated data centre systems

Silicon capacitors: A ubiquitous enabler in advanced 3D-integrated data centre systems

Pioneering next generation computing – beyond silicon

Pioneering next generation computing – beyond silicon

Mind the ultra-wide bandgap – gearing up for Gallium Oxide

Mind the ultra-wide bandgap – gearing up for Gallium Oxide

Optimising asset transactions in the semiconductor ecosystem

Optimising asset transactions in the semiconductor ecosystem

Study recommends reshoring semiconductor manufacturing to US and UK

Study recommends reshoring semiconductor manufacturing to US and UK

TI unveils high-performance isolated power modules

TI unveils high-performance isolated power modules

Two-phase cooling helps maximise AI performance

Two-phase cooling helps maximise AI performance

US expansion built on wet process systems success

US expansion built on wet process systems success

Removing a fundamental bottleneck to AI data centre growth

Removing a fundamental bottleneck to AI data centre growth

Connecting Innovation

Connecting Innovation

The journey to 800V DC – transforming the data centre

The journey to 800V DC – transforming the data centre

Synopsys simulation helps scale brain-inspired processors for edge devices

Synopsys simulation helps scale brain-inspired processors for edge devices

Mind the gap - turning AI ambition into execution

Mind the gap - turning AI ambition into execution

Accelerating SEMI EDA adoption

Accelerating SEMI EDA adoption

CHIPX™ establishes advanced front-end manufacturing capabilities in Malaysia

CHIPX™ establishes advanced front-end manufacturing capabilities in Malaysia

Industrialising 300 mm silicon photonics for bandwidth-hungry AI interconnects

Industrialising 300 mm silicon photonics for bandwidth-hungry AI interconnects

EU-India trade deal spells semiconductor success

EU-India trade deal spells semiconductor success

ICsense Opens New Electronic Wafer Sort Cleanroom

ICsense Opens New Electronic Wafer Sort Cleanroom

agileSecure safeguards SOCs

agileSecure safeguards SOCs

FAMES announces 2026 Open-Access Call for chip industry stakeholders

FAMES announces 2026 Open-Access Call for chip industry stakeholders

The increasing need for semiconductor thermal management

The increasing need for semiconductor thermal management

Swansea to lead UK Centre for Doctoral Training in semiconductor skills

Swansea to lead UK Centre for Doctoral Training in semiconductor skills

DRAM and NAND developments drive memory market

DRAM and NAND developments drive memory market

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures

Delivering world-first capability for orbital semiconductor manufacturing

Delivering world-first capability for orbital semiconductor manufacturing

Geopolitical uncertainty could boost the automotive market

Geopolitical uncertainty could boost the automotive market

Silicon Labs builds a future-ready SAP strategy

Silicon Labs builds a future-ready SAP strategy

Imec advances 2D-material based device technology

Imec advances 2D-material based device technology

Hot-water cooling addresses the AI power challenge

Hot-water cooling addresses the AI power challenge

Data centre demand drives WBG materials adoption and smart power management

Data centre demand drives WBG materials adoption and smart power management

AI - smaller models and inferencing key trends to watch

AI - smaller models and inferencing key trends to watch

Understanding advanced packaging trends

Understanding advanced packaging trends

Cloudberry launches Europe’s first semiconductor venture fund

Cloudberry launches Europe’s first semiconductor venture fund

Crescendo turns up the volume on vertical power delivery

Crescendo turns up the volume on vertical power delivery

A breakthrough tool for AI data centre design and optimisation

A breakthrough tool for AI data centre design and optimisation

Ignite Next launches Europe’s scale-up program for deep tech startups

Ignite Next launches Europe’s scale-up program for deep tech startups

Simplifying WBG semiconductor testing for labs and engineers

Simplifying WBG semiconductor testing for labs and engineers

AI continues to dominate the semiconductor space

AI continues to dominate the semiconductor space

The secrets behind Screen’s semiconductor success

The secrets behind Screen’s semiconductor success

Electronics visibility eliminates energy waste at the chip level, and beyond

Electronics visibility eliminates energy waste at the chip level, and beyond

New CEO to lead Wise Integration’s global growth

New CEO to lead Wise Integration’s global growth

Addressing the AI power challenge in the data centre

Addressing the AI power challenge in the data centre

Disruptive chipset platform transforms satellite agility, efficiency and sustainability

Disruptive chipset platform transforms satellite agility, efficiency and sustainability

sureCore launches suite of silicon services

sureCore launches suite of silicon services

Integrated Voltage Regulators for advanced electronics

Integrated Voltage Regulators for advanced electronics

Taking SiC switches to new highs

Taking SiC switches to new highs

Gen IV Plus Platform delivers for the data centre and beyond

Gen IV Plus Platform delivers for the data centre and beyond

GaN provides high power performance

GaN provides high power performance

SEMI Foundation acts as Coordinating Hub for major US microelectronics initiative

SEMI Foundation acts as Coordinating Hub for major US microelectronics initiative

Architecture for scaling AI data centres

Architecture for scaling AI data centres

GaN can in more and more places

GaN can in more and more places

New power switch architecture heads Menlo Microsystems’ innovation focus

New power switch architecture heads Menlo Microsystems’ innovation focus

EU Project ELENA positions Europe as a global leader in photonic chip manufacturing

EU Project ELENA positions Europe as a global leader in photonic chip manufacturing

Customer focus remains critical as Danisense launches calibration portal and 1-channel system interface unit

Customer focus remains critical as Danisense launches calibration portal and 1-channel system interface unit

New 3D chips could make electronics faster and more energy-efficient

New 3D chips could make electronics faster and more energy-efficient

The future of power conversion

The future of power conversion

iDEAL breaks through semiconductor barriers

iDEAL breaks through semiconductor barriers

Redefining power electronics through digital control

Redefining power electronics through digital control

Responsiveness as a competitive edge

Responsiveness as a competitive edge

SiC successes drive Bosch’s automotive strategy

SiC successes drive Bosch’s automotive strategy

Power silicon carbide device market to exceed $10 billion by 2030

Power silicon carbide device market to exceed $10 billion by 2030

Automotive advances focus on foundational semiconductors

Automotive advances focus on foundational semiconductors

Power and sensing reimagined

Power and sensing reimagined

Eumetrys measures up to industry challenges

Eumetrys measures up to industry challenges

Reversible computing and near zero-energy silicon chips

Reversible computing and near zero-energy silicon chips

Redefining automation in electronics manufacturing

Redefining automation in electronics manufacturing

Atom-thin semiconductors to tackle AI's surging energy costs

Atom-thin semiconductors to tackle AI's surging energy costs

CHIPDIPLO project seeks to strengthen European semiconductor industry

CHIPDIPLO project seeks to strengthen European semiconductor industry

DC-DC power modules help to bridge the 48V/12V transition

DC-DC power modules help to bridge the 48V/12V transition

Yole Group shares expert insights on the power module packaging industry

Yole Group shares expert insights on the power module packaging industry

Improving the renewable energy efficiency and optimisation

Improving the renewable energy efficiency and optimisation

Wafer handling solutions evolve for new materials and applications

Wafer handling solutions evolve for new materials and applications

Partnership drives supplier resilience and agility

Partnership drives supplier resilience and agility

Crescendo increases power density possibilities

Crescendo increases power density possibilities

AI data crucial to shaping an agile, robust supply chain strategy

AI data crucial to shaping an agile, robust supply chain strategy

STILE technology strengthens US semiconductor packaging advancements

STILE technology strengthens US semiconductor packaging advancements

Terecircuits shares material science innovations for advanced packaging applications

Terecircuits shares material science innovations for advanced packaging applications

NIL and MEMS - a powerful combination

NIL and MEMS - a powerful combination

Revolutionising semiconductor design

Revolutionising semiconductor design

Streamlining electronics system development

Streamlining electronics system development

New SMU helps semiconductor device development

New SMU helps semiconductor device development

China, geopolitics and the global semiconductor industry

China, geopolitics and the global semiconductor industry

SemiQ launches 1200 V Third-Generation SiC MOSFET

SemiQ launches 1200 V Third-Generation SiC MOSFET

SMU optimised for testing emerging nano/2D semiconductor devices

SMU optimised for testing emerging nano/2D semiconductor devices

Optimism overrides any causes for concern

Optimism overrides any causes for concern

Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology

Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology

Evaluating the performance of 1200V SiC devices

Evaluating the performance of 1200V SiC devices

PE International interview with Siglent

PE International interview with Siglent

Innovation opportunities excite JST’s new CTO

Innovation opportunities excite JST’s new CTO

Paving the way for cost-effective mmWave communication and sensing

Paving the way for cost-effective mmWave communication and sensing

Europe’s semiconductor industry focuses on sustainable growth

Europe’s semiconductor industry focuses on sustainable growth

Cementing semiconductor links between the UK and APAC

Cementing semiconductor links between the UK and APAC

US presence enhances ongoing success for AP&S

US presence enhances ongoing success for AP&S

ZEISS launches FIB-SEM optimised for TEM sample preparation

ZEISS launches FIB-SEM optimised for TEM sample preparation

The world’s first silicon photonic chip for FHE

The world’s first silicon photonic chip for FHE

Paving the way to piezoelectric converters without transformers

Paving the way to piezoelectric converters without transformers

Sustainability drives industry innovation

Sustainability drives industry innovation

AI power delivery for the data centre

AI power delivery for the data centre

WeEn plans a power-packed future

WeEn plans a power-packed future

An e-waste revolution

An e-waste revolution

SMC Diode Solutions opens second power discrete fab in Nanjing, China

SMC Diode Solutions opens second power discrete fab in Nanjing, China

Breaking barriers with AI in the semiconductor industry

Breaking barriers with AI in the semiconductor industry

Innovation Leadership Award recognises VisIC Technologies' GaN innovation

Innovation Leadership Award recognises VisIC Technologies' GaN innovation

The benefits of a semiconductor sustainability focus

The benefits of a semiconductor sustainability focus

A flexible future

A flexible future

NPUs emerging as GPU alternative in AI applications

NPUs emerging as GPU alternative in AI applications

Applied EV selects CISSOID’s SiC Inverter Control Module

Applied EV selects CISSOID’s SiC Inverter Control Module

Redefining energy-efficient processing

Redefining energy-efficient processing

Transforming EBL into a volume-production system for emerging applications

Transforming EBL into a volume-production system for emerging applications

Probing system provides precise measurements of fast switching signals

Probing system provides precise measurements of fast switching signals

Expanded power portfolio is electrifying

Expanded power portfolio is electrifying

Power performance solutions leverage integrated packaging design

Power performance solutions leverage integrated packaging design

Innovation centre promises a power-packed future

Innovation centre promises a power-packed future

Compact wireless powering technology - good for your health

Compact wireless powering technology - good for your health

PREVAIL project promises Edge AI chip innovation

PREVAIL project promises Edge AI chip innovation

Perfecting the art of power management performance

Perfecting the art of power management performance

Supply chain resilience critical to minimise industry volatility

Supply chain resilience critical to minimise industry volatility

A layer transfer technology revolution

A layer transfer technology revolution

aIPDs overcome the power efficiency problem

aIPDs overcome the power efficiency problem

Team αCentauri's No. 85 Solar Car Featuring PowiGaN Technology

Team αCentauri's No. 85 Solar Car Featuring PowiGaN Technology

AngelTech Rewind 2023

AngelTech Rewind 2023

AngelTech 2022 Event

AngelTech 2022 Event

Silicon Carbide: The Future of Power Electronics

Silicon Carbide: The Future of Power Electronics

SiC Power Devices

SiC Power Devices

How to Use SiC in Power Electronics

How to Use SiC in Power Electronics

Fundamentals of Power Electronics

Fundamentals of Power Electronics