Rohm launches SiC MOSFETs in TOLL packaging
Rohm has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages.
Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39 percent improved thermal performance, according to Rohm.
This enables high-power handling despite their compact size and low profile. It is ideal for industrial equipment such as server power supplies and ESS (Energy Storage Systems) where the power density is increasing, and low-profile components are required to enable miniaturised product design.
In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturisation, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.
Rohm's new product addresses these needs by reducing component footprint by approximately 26 percent and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, Rohm's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.
The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025. These products are available for online purchase from online distributors such as DigiKey, MOUSER and Farnell. Simulation models for all six new products are available on Rohm's official website, supporting rapid circuit design evaluation.
